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Electroplating Shop
In this process step, electrolysis is used to plate copper onto the tracks, surface and into the vias. The thickness of the copper sheet depends on the specifications that our customers require. In general, the outer layer is 40-50 µm or 105 µm thick and the copper plating into the holes 25 µm.
Our electroplating machine then applies pure tin to the surfaces and bores. The tin acts as etching resist and protects certain areas of the copper foil in the following process.
Copper Plating
Quality Control – After the electroplating process is finished, Hotoprint measures the thickness of the copper layer with the FISCHERSCOPE®. Once confirmed, the printed circuit board moves on to the next process step. The results are recorded and, even at this early stage, allow us to rate the quality oft he PCB.
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Our electroplating machine then applies pure tin to the surfaces and bores. The tin acts as etching resist and protects certain areas of the copper foil in the following process.
Copper Plating
Quality Control – After the electroplating process is finished, Hotoprint measures the thickness of the copper layer with the FISCHERSCOPE®. Once confirmed, the printed circuit board moves on to the next process step. The results are recorded and, even at this early stage, allow us to rate the quality oft he PCB.
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+49 (0) 51 83 - 94 05 - 20 
pcb(at)hotoprint.de